CAS: 7440-50-8 - Copper

Formel: Cu

InChl: InChI=1S/Cu

InChI Key: InChIKey=RYGMFSIKBFXOCR-UHFFFAOYSA-N

SMILES: [Cu]

Synonyme:

• 1.65Edcu12-100Fa
• 1000Y
• 100Rxh
• 1020P
• 1020Y
• 1030Y
• 1050Y
• 1050Yf
• 1050Yp
• 1100T
• 1100Y
• 115A
• 1300N
• 1300Y
• 1300Ym
• 1300Yp
• 1400Y
• 1400Ym
• 1400Yp
• 1500Y
• 200Rl
• 22Bb400
• 2L3Gt
• 3EC
• 3Ec-Hte
• 3Ec-Iii
• 3Ec-Lpiii
• 3Ec-M1S-Vlp
• 3Ec-M2S-Hte-Sp2
• 3Ec-M35Hte-Ed
• 3Ec-M3S-Hte
• 3Ec-M3S-The
• 3Ec-M3Vlp
• 3Ec-M3Vlp18
• 3Ec-Vep
• 3Ec-Vlp
• 3Ec-Vlp18
• 3Ec-Vlp35
• 3Ec11
• 3Ec3
• 3Ecvlp12
• 3Ecvlp9
• 3El-Vlp
• 3L3
• AFS-Cu
• Aeromesh
• Am-Fn
• Aquatrine
• B-Ws
• B152-Etp
• BHN
• BHY
• BSH
• Bf-Tza
• Bh-Ws
• Bhy-Ha
• Bhy-X
• CDX
• Cobre
• Copper(2+)
• Copper-Celmet
• CopperfoilNmmthick
• CopperfoilNmmthickxmmwide
• CopperpowderNmesh
• Copperpowderdendritic
• Copperpowdermeshunderargon
• Copperpowdersphericalmesh
• CoppershotNmm
• CoppershotNmmdia
• CopperturningsN
• CopperwireNmmdia
• Copperwireclothmeshmmwidemmwiredia
• Copperwiremmdia
• Copperwiresreducedfromoxide
• Cu
• Cu-HWQ
• Cu1030Y
• CuEP
• CuEPP
• Cuivre
• Cuprum
• Dt-Gld
• Exp-Dt-Nc
• F-Cp
• F-Ws
• FGP
• FSM
• FWL
• Fcc-Cp-Xo
• Fcc-Sp99X
• Fcc-Tb
• Fi-Ws
• Fld-Ws
• Fmc-10
• Fmc-Sb
• Fq-Vlp
• Fv-Ws
• Fv-Wz
• Fvo-Ws
• Fwg-Ws
• Fwl-Ws
• Fx-Bsh
• Fzo-Ws
• GT
• GTS
• Gt-Mp
• Gts-Std
• Gtsmp
• HCX-Cu
• HLB
• HTE
• HXR-Cu
• Hlp-Lc-12
• Hlpfn
• Hlplcn
• Hpf-St-X
• Hs-Vsp
• JTC
• Jdlcn
• Jtc-A
• Jtc-Am
• Jtc-Lp
• Jtclpz
• Jtcs
• Jxefl-Bhm
• Jxut-Ii
• Jxut-Iii
• Kupfer
• MF-D₂
• MF-D₃
• MT-Ex
• Ma-C-S
• Ma-C025Kfd
• Ma-Cc
• Ma-Cd
• Ma-Cds
• Ma-Ch-S
• Ma-Cjf
• Ma-Coj
• Ma-Hwq
• Mf-D2
• Mf-D3
• Mf-Dz
• Mls-G
• Mtsd-H
• Mw-P-Vsp
• N-Cu-A
• Na-Def
• Na-Dff
• Na-Vlp
• Nc-Wc
• Nc-Ws
• Ndgc
• Ndp-Iii
• Ns-Vlp
• Nt-Tax-M
• Nt-Tax-O
• Ofhc
• Qf-Vlp
• Rame
• Raney-Copper
• SFR-Cu
• SLP
• Sq-Hte
• Sq-Vlp
• Srm394
• Srm395
• T9Da-Sv
• TAI
• TU1
• TUP
• Tpiii(M)
• Tq-Lp
• Tq-Vlp
• Tsto
• Ttai
• Uclp-Se
• Uslp
• Uslp-S
• Uslp-Se
• Vsbk
• XMCu
• XTF
• Ym-Ag
• Copper turnings
• 1721 Gold
• Bronze, powder
• Copper foil(99%)
• Copper wire (99.99) 0.25mm dia.
• Copper wire cloth
• Copper
• Copper metal wire
• C.I. 77400
• C.I. Pigment Metal 2
• Copper, small rods for elemental analysis
• Copper foil(99.9%)
• Electrolytic tough pitch copper (O)
• Copper solution 10 000 ppm
• Sponge copper
• Copper nanopowder
• copper coating quality balzers
• Electrolytic copper (trace elements)
• Copper ingot
• Continuous cast copper (O)
• Copper
• Copper metal foil
• Copper powder
• Copper wire (99.999%) 0.76mm dia.
• CopperrodNmmdiacElectrolytic copperagcm
• C.I. Pigment Metal 2
• Copper shot(99.9) 1-10mm
• Electrolytic copper
• raney-copper ready for use
• Copper (O)
• Copper solution 1000 ppm
• Copper (S, P)
• Copper shot(99.999%) 2-8mm
• Copper with added impurities (trace elements)
• Copper foil (99.9985%)

Copper Sputtering Target 3mm thickness, 99.9%

CAS: 7440-50-8

Copper Wire (OFHC) 0.075 mm diameter, annealed, 99.99%

CAS: 7440-50-8

Copper Wire 1.0 mm diameter, annealed, 99.998%

CAS: 7440-50-8

Copper Wire 0.05 mm diameter, annealed, 99.9%

CAS: 7440-50-8

• Formel: Cu
• Reinheit: ≥ 99.9% (Incl. Ag)
• Farbe und Form: Uniform copper coloured wire
• Molekulargewicht: 63.55

Copper Sputtering Target 3mm thickness, 99.99%

CAS: 7440-50-8

Copper Sputtering Target 6mm thickness, 99.99%

CAS: 7440-50-8

• Reinheit: ≥ 99.99%
• Farbe und Form: Solid copper disc

Copper Sputtering Target 6mm thickness, 99.999%

CAS: 7440-50-8

Copper Foil 1.0 mm, 99.995+%

CAS: 7440-50-8

Copper Sputtering Target 6mm thickness, 99.9%

CAS: 7440-50-8

Copper, powder -100 mesh

CAS: 7440-50-8

• Reinheit: 99%
• Farbe und Form: Powder
• Molekulargewicht: 63.55g/mol

Copper shot (99.9%)

CAS: 7440-50-8

• Formel: Cu
• Reinheit: (99.9%)
• Farbe und Form: 1-10 mm
• Molekulargewicht: 63.54

Copper, powder -125 mesh

CAS: 7440-50-8

• Reinheit: 99.9%
• Molekulargewicht: 63.55g/mol

Copper powder, 325 mesh, 99%

CAS: 7440-50-8

• Formel: Cu
• Reinheit: ≥ 99.0%
• Farbe und Form: Brown to orange red powder
• Molekulargewicht: 63.55

Copper Sputtering Target 3mm thickness, 99.999%

CAS: 7440-50-8

Cannabis Target Elements Mixture B 1-300 µg/mL in 5% HNO3, tr. HF

CAS: 7439-93-2 7439-98-7 7440-02-0 7440-22-4 7440-28-0 7440-31-5 7440-36-0 7440-39-3 7440-47-3 7440-48-4 7440-50-87440-62-2 7782-49-2

• Farbe und Form: Mixture

Trace Metals Mixture for eCigarettes 10 µg/mL in 2% HNO3

CAS: 7440-02-0 7440-43-9 7440-47-3 7440-50-8

• Farbe und Form: Mixture

Copper Wire 1.0 mm diameter, 99.9%

CAS: 7440-50-8

• Reinheit: ≥ 99.9%
• Farbe und Form: Uniform copper coloured wire

Copper Wire 0.125 mm diameter, annealed, 99.998%

CAS: 7440-50-8

Copper nanopowder, 99.5% [50nm]

CAS: 7440-50-8

• Formel: Cu
• Reinheit: ≥ 99.5%
• Farbe und Form: Brown to very dark powder
• Molekulargewicht: 63.55

Copper Shot max. 6 mm, vacuum melted, 99.999%

CAS: 7440-50-8