Copper Powder Cu-OF atomized >=10 micron, d50 = 15 micron, 99.95%

CAS: 7440-50-8

Ref. 7W-GX9201

Produktinformation

• Name: Copper Powder Cu-OF atomized >=10 micron, d50 = 15 micron, 99.95%
• Synonyme: 1.65Edcu12-100Fa, 1000Y, 100Rxh, 1020P, 1020Y, 1030Y, 1050Y, 1050Yf, 1050Yp, 1100T, 1100Y, 115A, 1300N, 1300Y, 1300Ym, 1300Yp, 1400Y, 1400Ym, 1400Yp, 1500Y, 200Rl, 22Bb400, 2L3Gt, 3EC, 3Ec-Hte, 3Ec-Iii, 3Ec-Lpiii, 3Ec-M1S-Vlp, 3Ec-M2S-Hte-Sp2, 3Ec-M35Hte-Ed, 3Ec-M3S-Hte, 3Ec-M3S-The, 3Ec-M3Vlp, 3Ec-M3Vlp18, 3Ec-Vep, 3Ec-Vlp, 3Ec-Vlp18, 3Ec-Vlp35, 3Ec11, 3Ec3, 3Ecvlp12, 3Ecvlp9, 3El-Vlp, 3L3, AFS-Cu, Aeromesh, Am-Fn, Aquatrine, B-Ws, B152-Etp, BHN, BHY, BSH, Bf-Tza, Bh-Ws, Bhy-Ha, Bhy-X, CDX, Cobre, Copper(2+), Copper-Celmet, CopperfoilNmmthick, CopperfoilNmmthickxmmwide, CopperpowderNmesh, Copperpowderdendritic, Copperpowdermeshunderargon, Copperpowdersphericalmesh, CoppershotNmm, CoppershotNmmdia, CopperturningsN, CopperwireNmmdia, Copperwireclothmeshmmwidemmwiredia, Copperwiremmdia, Copperwiresreducedfromoxide, Cu, Cu-HWQ, Cu1030Y, CuEP, CuEPP, Cuivre, Cuprum, Dt-Gld, Exp-Dt-Nc, F-Cp, F-Ws, FGP, FSM, FWL, Fcc-Cp-Xo, Fcc-Sp99X, Fcc-Tb, Fi-Ws, Fld-Ws, Fmc-10, Fmc-Sb, Fq-Vlp, Fv-Ws, Fv-Wz, Fvo-Ws, Fwg-Ws, Fwl-Ws, Fx-Bsh, Fzo-Ws, GT, GTS, Gt-Mp, Gts-Std, Gtsmp, HCX-Cu, HLB, HTE, HXR-Cu, Hlp-Lc-12, Hlpfn, Hlplcn, Hpf-St-X, Hs-Vsp, JTC, Jdlcn, Jtc-A, Jtc-Am, Jtc-Lp, Jtclpz, Jtcs, Jxefl-Bhm, Jxut-Ii, Jxut-Iii, Kupfer, MF-D₂, MF-D₃, MT-Ex, Ma-C-S, Ma-C025Kfd, Ma-Cc, Ma-Cd, Ma-Cds, Ma-Ch-S, Ma-Cjf, Ma-Coj, Ma-Hwq, Mf-D2, Mf-D3, Mf-Dz, Mls-G, Mtsd-H, Mw-P-Vsp, N-Cu-A, Na-Def, Na-Dff, Na-Vlp, Nc-Wc, Nc-Ws, Ndgc, Ndp-Iii, Ns-Vlp, Nt-Tax-M, Nt-Tax-O, Ofhc, Qf-Vlp, Rame, Raney-Copper, SFR-Cu, SLP, Sq-Hte, Sq-Vlp, Srm394, Srm395, T9Da-Sv, TAI, TU1, TUP, Tpiii(M), Tq-Lp, Tq-Vlp, Tsto, Ttai, Uclp-Se, Uslp, Uslp-S, Uslp-Se, Vsbk, XMCu, XTF, Ym-Ag, Copper turnings, 1721 Gold, Bronze, powder, Copper foil(99%), Copper wire (99.99) 0.25mm dia., Copper wire cloth, Copper, Copper metal wire, C.I. 77400, C.I. Pigment Metal 2, Copper, small rods for elemental analysis, Copper foil(99.9%), Electrolytic tough pitch copper (O), Copper solution 10 000 ppm, Sponge copper, Copper nanopowder, copper coating quality balzers, Electrolytic copper (trace elements), Copper ingot, Continuous cast copper (O), Copper, Copper metal foil, Copper powder, Copper wire (99.999%) 0.76mm dia., CopperrodNmmdiacElectrolytic copperagcm, C.I. Pigment Metal 2, Copper shot(99.9) 1-10mm, Electrolytic copper, raney-copper ready for use, Copper (O), Copper solution 1000 ppm, Copper (S, P), Copper shot(99.999%) 2-8mm, Copper with added impurities (trace elements), Copper foil (99.9985%)
• Marke: Glentham

Chemische Eigenschaften

• Molekulargewicht: 63.55
• Formel: Cu
• Reinheit: ≥ 99.95% (metals basis)
• Farbe/Form: Dark orange to dark brown powder