Copper Powder

CAS : 7440-50-8

Ref. TR-C685340

Informations sur le produit

• Nom: Copper Powder
• Synonymes: Copper, Cuprum, Blister copper, Cathode copper, 1.65Edcu12-100Fa, 1000Y, 100Rxh, 1020P, 1020Y, 1030Y, 1050Y, 1050Yf, 1050Yp, 1100T, 1100Y, 115A, 1300N, 1300Y, 1300Ym, 1300Yp, 1400Y, 1400Ym, 1400Yp, 1500Y, 200Rl, 22Bb400, 2L3Gt, 3EC, 3Ec-Hte, 3Ec-Iii, 3Ec-Lpiii, 3Ec-M1S-Vlp, 3Ec-M2S-Hte-Sp2, 3Ec-M35Hte-Ed, 3Ec-M3S-Hte, 3Ec-M3S-The, 3Ec-M3Vlp, 3Ec-M3Vlp18, 3Ec-Vep, 3Ec-Vlp, 3Ec-Vlp18, 3Ec-Vlp35, 3Ec11, 3Ec3, 3Ecvlp12, 3Ecvlp9, 3El-Vlp, 3L3, AFS-Cu, Aeromesh, Am-Fn, Aquatrine, B-Ws, B152-Etp, BHN, BHY, BSH, Bf-Tza, Bh-Ws, Bhy-Ha, Bhy-X, CDX, Cobre, Copper(2+), Copper-Celmet, CopperfoilNmmthick, CopperfoilNmmthickxmmwide, CopperpowderNmesh, Copperpowderdendritic, Copperpowdermeshunderargon, Copperpowdersphericalmesh, CoppershotNmm, CoppershotNmmdia, CopperturningsN, CopperwireNmmdia, Copperwireclothmeshmmwidemmwiredia, Copperwiremmdia, Copperwiresreducedfromoxide, Cu, Cu-HWQ, Cu1030Y, CuEP, CuEPP, Cuivre, Dt-Gld, Exp-Dt-Nc, F-Cp, F-Ws, FGP, FSM, FWL, Fcc-Cp-Xo, Fcc-Sp99X, Fcc-Tb, Fi-Ws, Fld-Ws, Fmc-10, Fmc-Sb, Fq-Vlp, Fv-Ws, Fv-Wz, Fvo-Ws, Fwg-Ws, Fwl-Ws, Fx-Bsh, Fzo-Ws, GT, GTS, Gt-Mp, Gts-Std, Gtsmp, HCX-Cu, HLB, HTE, HXR-Cu, Hlp-Lc-12, Hlpfn, Hlplcn, Hpf-St-X, Hs-Vsp, JTC, Jdlcn, Jtc-A, Jtc-Am, Jtc-Lp, Jtclpz, Jtcs, Jxefl-Bhm, Jxut-Ii, Jxut-Iii, Kupfer, MF-D₂, MF-D₃, MT-Ex, Ma-C-S, Ma-C025Kfd, Ma-Cc, Ma-Cd, Ma-Cds, Ma-Ch-S, Ma-Cjf, Ma-Coj, Ma-Hwq, Mf-D2, Mf-D3, Mf-Dz, Mls-G, Mtsd-H, Mw-P-Vsp, N-Cu-A, Na-Def, Na-Dff, Na-Vlp, Nc-Wc, Nc-Ws, Ndgc, Ndp-Iii, Ns-Vlp, Nt-Tax-M, Nt-Tax-O, Ofhc, Qf-Vlp, Rame, Raney-Copper, SFR-Cu, SLP, Sq-Hte, Sq-Vlp, Srm394, Srm395, T9Da-Sv, TAI, TU1, TUP, Tpiii(M), Tq-Lp, Tq-Vlp, Tsto, Ttai, Uclp-Se, Uslp, Uslp-S, Uslp-Se, Vsbk, XMCu, XTF, Ym-Ag, Copper turnings, 1721 Gold, Bronze, powder, Copper foil(99%), Copper wire (99.99) 0.25mm dia., Copper wire cloth, Copper, Copper metal wire, C.I. 77400, C.I. Pigment Metal 2, Copper, small rods for elemental analysis, Copper foil(99.9%), Electrolytic tough pitch copper (O), Copper solution 10 000 ppm, Sponge copper, Copper nanopowder, copper coating quality balzers, Electrolytic copper (trace elements), Copper ingot, Continuous cast copper (O), Copper metal foil, Copper powder, Copper wire (99.999%) 0.76mm dia., CopperrodNmmdiacElectrolytic copperagcm, C.I. Pigment Metal 2, Copper shot(99.9) 1-10mm, Electrolytic copper, raney-copper ready for use, Copper (O), Copper solution 1000 ppm, Copper (S, P), Copper shot(99.999%) 2-8mm, Copper with added impurities (trace elements), Copper foil (99.9985%)

Description

Applications Copper is a metal with a number of properties and uses, some of which include metal-organic framework-driven copper/carbon polyhedron which describes the synthesis, characterization and the role of copper in electrochemistry properties. Copper is used in electrochemical, radiational, and thermal energy technology studies.
References Qiao, Lulu., Journal of Materials Science, 53, 7755-7766, (2018)

• Marque: TRC

Propriétés chimiques

• Masse moléculaire: 63.55
• Formule: Cu
• Couleur/Forme: Neat
• InChI: InChI=1S/Cu
• Code InChI: InChIKey=RYGMFSIKBFXOCR-UHFFFAOYSA-N
• SMILES: [Cu]