COPPER(II) HEXAFLUORO-2,4-PENTANEDIONATE, dihydrate
CAS: 14781-45-4
Rif. 3H-AKC253
5g | Prezzo su richiesta | ||
50g | Prezzo su richiesta |
Informazioni sul prodotto
- (E)-1,1,1,5,5,5-hexafluoro-4-oxo-pent-2-en-2-olate
- (SP-4-1)-Bis(1,1,1,5,5,5-hexafluoro-2,4-pentanedionato-κO<sup>2</sup>,κO<sup>4</sup>)copper
- 2,4-Pentanedione, 1,1,1,5,5,5-hexafluoro-, copper deriv.
- Bis(1,1,1,5,5,5-hexafluoro-2,4-pentanedionato)copper (II)
- Bis(1,1,1,5,5,5-hexafluoroacetylacetonato)copper(II)
- Bis(hexafluoroacetoacetonato)copper(II)
- Bis(hexafluoroacetylacetonate)copper(II)
- Bis(hexafluoroacetylacetonato)copper
- Bis(hexafluoroacetylacetonato)copper(II)
- Bis(hexafluroroacetylacetonato)copper
- Vedi altri sinonimi
- Copper hexafluoroacetylacetonate
- Copper(II) bis(hexafluoroacetylacetonate)
- Copper(II) hexafluoroacetylacetonate
- Copper(II) hexafluoroacetylacetonate hydrate
- Copper(Ii) Hexafluoro-2,4-Pentanedionate
- Copper, bis(1,1,1,5,5,5-hexafluoro-2,4-pentanedionato)-
- Copper, bis(1,1,1,5,5,5-hexafluoro-2,4-pentanedionato-O,O′)-, (SP-4-1)-
- Copper, bis(1,1,1,5,5,5-hexafluoro-2,4-pentanedionato-κO,κO′)-, (SP-4-1)-
- Copper, bis(1,1,1,5,5,5-hexafluoro-2,4-pentanedionato-κO<sup>2</sup>,κO<sup>4</sup>)-, (SP-4-1)-
- bis[(Z)-4,4,4-trifluoro-3-oxo-1-(trifluoromethyl)but-1-enoxy]copper hydrate
- copper(2+) bis[(2Z)-1,1,1,5,5,5-hexafluoro-4-oxopent-2-en-2-olate]
- copper,(Z)-1,1,1,5,5,5-hexafluoro-4-oxo-pent-2-en-2-olate
ALD Material
Atomic layer deposition (ALD) is a chemically self-limiting deposition technique that is based on the sequential use of a gaseous chemical process. A thin film (as fine as -0.1 Å per cycle) results from repeating the deposition sequence as many times as needed to reach a certain thickness. The major characteristic of the films is the resulting conformality and the controlled deposition manner. Precursor selection is key in ALD processes, namely finding molecules which will have enough reactivity to produce the desired films yet are stable enough to be handled and safely delivered to the reaction chamber.
Copper (II) hexafluoro-2,4-pentanedionate, dihydrate; Cupric hexafluoroacetylacetonate
Vapor pressure, 50 °C: 1 mmVapor pressure, 95 °C: 10 mmSolubility, methanol: >200 g/LSoluble: methanol, acetone, tolueneEmployed in CVD of superconductorsCatalyst for addition of diazopentanediones to aldehydes and ketones to form dioxolesCu thin films deposited with H2 at 250 °CForms ferromagnetic chains on photolysis with diazodi-4-pyridylmethane
Proprietà chimiche
Richiesta tecnica su: 3H-AKC253 COPPER(II) HEXAFLUORO-2,4-PENTANEDIONATE, dihydrate
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