COPPER(II) 2,4-PENTANEDIONATE

CAS: 13395-16-9

Ref. 3H-AKC260

Informação sobre produto

• Nome: COPPER(II) 2,4-PENTANEDIONATE
• Sinónimos: (2Z)-4-oxopent-2-en-2-olate, (3Z)-4-hydroxypent-3-en-2-one-copper (2:1), (SP-4-1)-Bis(2,4-pentanedionato-κO²,κO⁴)copper, 2,4-Pentanedione, Copper(2+) Salt, 2,4-Pentanedione, Copper(2+) Salt (1:1), 4-Oxopent-2-en-2-olate de cuivre(II), 4-oxopent-2-en-2-olato de cobre(II), 4-oxopent-2-ene-2-olate de cuivre(II), Acetylacetonate, Copper (Ii), Bis(2,4-pentanedionato)copper, Bis(2,4-pentanedionato)copper(II), Bis(acetylacetonato)copper, Bis(acetylacetonato)copper(II), Bis(acetylacetone)copper, Cd 9, Copper acetylacetonate, Copper bis(2,4-pentanedionate), Copper bis(acetylacetonate), Copper bis(acetylacetone), Copper diacetylacetonate, Copper(2+) bis(acetylacetonate), Copper(II) bis(2,4-pentanedionate), Copper(II)-2,4-pentanedionate, Copper, bis(2,4-pentanedionato)-, Copper, bis(2,4-pentanedionato-O,O')-, (SP-4-1)-, Copper, bis(2,4-pentanedionato-κO,κO')-, (SP-4-1)-, Copper, bis(2,4-pentanedionato-κO2,κO4)-, (SP-4-1)-, Copper, bis(2,4-pentanedionato-κO²,κO⁴)-, (SP-4-1)-, Copperacetylacetonate, Copperpentanedionate, Cupric acetylacetonate, Cupric bis(2,4-pentanedionate), Nacem Copper, copper(II) 4-oxopent-2-en-2-olate, kupfer(II)-4-oxopent-2-en-2-olat
• CAS: 13395-16-9

Descrição

ALD Material
Atomic layer deposition (ALD) is a chemically self-limiting deposition technique that is based on the sequential use of a gaseous chemical process. A thin film (as fine as -0.1 Å per cycle) results from repeating the deposition sequence as many times as needed to reach a certain thickness. The major characteristic of the films is the resulting conformality and the controlled deposition manner. Precursor selection is key in ALD processes, namely finding molecules which will have enough reactivity to produce the desired films yet are stable enough to be handled and safely delivered to the reaction chamber.
Copper (II) 2,4-pentanedionate; Cupric acetylacetonate
Color: pale blueMetal content: 2.8-24.5% CuVapor pressure, 100 °C: 0.001 mmVapor pressure, 163 °C': 0.1 mmSolubility, dimethylsulfoxide: 4.4 g/LSolubility, toluene: 0.4 g/LSolubility, water: 0.2 g/LStability constant, pKa dioxane/water: 9.7Catalyst for the reduction of nitro-aromatics NaBH4Catalyst for hydrogenation of unsaturated fatsCatalyst for flexible urethanesExcimer laser induces deposition of copperMetal-Organic Chemical Vapor Deposition (MOCVD) generates copper oxide filmsForms ferromagnetic chains on photolysis with diazodi-4-pyridylmethane

• Marca: Gelest

Propriedades químicas

• Peso molecular: 261.76
• Fórmula: C₁₀H₁₄CuO₄
• Cor/forma: Blue Solid