Copper sputtering target, 50.8mm (2.0in) dia x 6.35mm (0.250in) thick, 99.995% (metals basis)

CAS: 7440-50-8

Ref. 02-043039

Product Information

• Name: Copper sputtering target, 50.8mm (2.0in) dia x 6.35mm (0.250in) thick, 99.995% (metals basis)
• Synonyms: copper, kupfer, cobre, cuivre, copper atom, cuprum, copper(0), Cun, 1.65Edcu12-100Fa, 1000Y, 100Rxh, 1020P, 1020Y, 1030Y, 1050Y, 1050Yf, 1050Yp, 1100T, 1100Y, 115A, 1300N, 1300Y, 1300Ym, 1300Yp, 1400Y, 1400Ym, 1400Yp, 1500Y, 200Rl, 22Bb400, 2L3Gt, 3EC, 3Ec-Hte, 3Ec-Iii, 3Ec-Lpiii, 3Ec-M1S-Vlp, 3Ec-M2S-Hte-Sp2, 3Ec-M35Hte-Ed, 3Ec-M3S-Hte, 3Ec-M3S-The, 3Ec-M3Vlp, 3Ec-M3Vlp18, 3Ec-Vep, 3Ec-Vlp, 3Ec-Vlp18, 3Ec-Vlp35, 3Ec11, 3Ec3, 3Ecvlp12, 3Ecvlp9, 3El-Vlp, 3L3, AFS-Cu, Aeromesh, Am-Fn, Aquatrine, B-Ws, B152-Etp, BHN, BHY, BSH, Bf-Tza, Bh-Ws, Bhy-Ha, Bhy-X, CDX, Cobre, Copper(2+), Copper-Celmet, CopperfoilNmmthick, CopperfoilNmmthickxmmwide, CopperpowderNmesh, Copperpowderdendritic, Copperpowdermeshunderargon, Copperpowdersphericalmesh, CoppershotNmm, CoppershotNmmdia, CopperturningsN, CopperwireNmmdia, Copperwireclothmeshmmwidemmwiredia, Copperwiremmdia, Copperwiresreducedfromoxide, Cu, Cu-HWQ, Cu1030Y, CuEP, CuEPP, Cuivre, Cuprum, Dt-Gld, Exp-Dt-Nc, F-Cp, F-Ws, FGP, FSM, FWL, Fcc-Cp-Xo, Fcc-Sp99X, Fcc-Tb, Fi-Ws, Fld-Ws, Fmc-10, Fmc-Sb, Fq-Vlp, Fv-Ws, Fv-Wz, Fvo-Ws, Fwg-Ws, Fwl-Ws, Fx-Bsh, Fzo-Ws, GT, GTS, Gt-Mp, Gts-Std, Gtsmp, HCX-Cu, HLB, HTE, HXR-Cu, Hlp-Lc-12, Hlpfn, Hlplcn, Hpf-St-X, Hs-Vsp, JTC, Jdlcn, Jtc-A, Jtc-Am, Jtc-Lp, Jtclpz, Jtcs, Jxefl-Bhm, Jxut-Ii, Jxut-Iii, Kupfer, MF-D₂, MF-D₃, MT-Ex, Ma-C-S, Ma-C025Kfd, Ma-Cc, Ma-Cd, Ma-Cds, Ma-Ch-S, Ma-Cjf, Ma-Coj, Ma-Hwq, Mf-D2, Mf-D3, Mf-Dz, Mls-G, Mtsd-H, Mw-P-Vsp, N-Cu-A, Na-Def, Na-Dff, Na-Vlp, Nc-Wc, Nc-Ws, Ndgc, Ndp-Iii, Ns-Vlp, Nt-Tax-M, Nt-Tax-O, Ofhc, Qf-Vlp, Rame, Raney-Copper, SFR-Cu, SLP, Sq-Hte, Sq-Vlp, Srm394, Srm395, T9Da-Sv, TAI, TU1, TUP, Tpiii(M), Tq-Lp, Tq-Vlp, Tsto, Ttai, Uclp-Se, Uslp, Uslp-S, Uslp-Se, Vsbk, XMCu, XTF, Ym-Ag, Copper turnings, 1721 Gold, Bronze, powder, Copper foil(99%), Copper wire (99.99) 0.25mm dia., Copper wire cloth, Copper, Copper metal wire, C.I. 77400, C.I. Pigment Metal 2, Copper, small rods for elemental analysis, Copper foil(99.9%), Electrolytic tough pitch copper (O), Copper solution 10 000 ppm, Sponge copper, Copper nanopowder, copper coating quality balzers, Electrolytic copper (trace elements), Copper ingot, Continuous cast copper (O), Copper, Copper metal foil, Copper powder, Copper wire (99.999%) 0.76mm dia., CopperrodNmmdiacElectrolytic copperagcm, C.I. Pigment Metal 2, Copper shot(99.9) 1-10mm, Electrolytic copper, raney-copper ready for use, Copper (O), Copper solution 1000 ppm, Copper (S, P), Copper shot(99.999%) 2-8mm, Copper with added impurities (trace elements), Copper foil (99.9985%)

Description

Sputtering targets commonly used to coat electronic components and electronic instruments. Due to its high electrical conductivity, copper is becoming increasingly popular for use in large-format, high-resolution TFT-LCD television sets. Copper is used as the electrode layer in thin-film transistors. This Thermo Scientific Chemicals brand product was originally part of the Alfa Aesar product portfolio. Some documentation and label information may refer to the legacy brand. The original Alfa Aesar product / item code or SKU reference has not changed as a part of the brand transition to Thermo Scientific Chemicals.

• Brand: Alfa Aesar By Thermo Fisher Scientific

Chemical properties

• Molecular weight: 63.55
• Formula: Cu
• Purity: 99.995%
• Color/Form: Sputtering target, 50.8mm (2.0in) diameter x 6.35mm (0.250in) thick.
• InChI key: RYGMFSIKBFXOCR-UHFFFAOYSA-N