Product Information
- 3DMAS
- Brn 1901643
- Ls 1460
- N,N,N',N',N'',N''-Hexamethylsilanetriamine
- Silanetriamine, N,N,N',N',N'',N''-hexamethyl-
- Tri(dimethylamino)silane
- Tris(Dimethylamino)Silyl
- [Bis(dimethylamino)silyl]dimethylamine
- Tris(dimethylamino)silane
ALD Material
Atomic layer deposition (ALD) is a chemically self-limiting deposition technique that is based on the sequential use of a gaseous chemical process. A thin film (as fine as -0.1 Å per cycle) results from repeating the deposition sequence as many times as needed to reach a certain thickness. The major characteristic of the films is the resulting conformality and the controlled deposition manner. Precursor selection is key in ALD processes, namely finding molecules which will have enough reactivity to produce the desired films yet are stable enough to be handled and safely delivered to the reaction chamber.
Tris(dimethylamino)silane; Tris(dimethylamido)silylhydride; N,N,N',N',N'',N''-Hexamethylsilanetriamine
AIR TRANSPORT FORBIDDENVapor pressure, 4 °C: 1 6 mmHydrosilylates olefins in presence of Rh2Cl2(CO)4Reacts with ammonia to form silicon nitride prepolymersEmployed in low pressure CVD of silicon nitride
Chemical properties
Technical inquiry about: 3H-SIT8714.0 TRIS(DIMETHYLAMINO)SILANE
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